Semiconductor solutions, from sourcing to project support.
We help hardware teams secure critical components, review supply risks, explore Edge AI projects, and coordinate packaging requirements with capable partners.
Enter a part number and quantity. They carry straight into the inquiry form below.
Request availabilityFour ways we help
Start with one part number or a full project. YM is your single point of contact and coordinates each request.
Component Sourcing
Memory, power, PMIC, MCU and analog parts for production and long-life products.
02BOM Support
Review supply exposure and explore potential alternatives with your team.
03Edge AI Consultation
Explore project requirements and hardware options with YM and our technical partner.
04Packaging Services
Submit discrete packaging requirements for process and capacity review.
The parts your build depends on, sourced with care.
Send a part number and quantity. We check availability and reply with pricing and lead-time options for your review.
Continuity of supply
Focus on the parts that matter most for keeping long-life products shipping.
Risk review
Priority parts reviewed for availability, lifecycle status and lead-time exposure.
Alternate evaluation
We can identify potential alternatives for your team to assess. Final compatibility and qualification remain subject to your engineering validation.
See supply risks before they stop your line.
Share your BOM and tell us where supply continuity matters most. We can review priority parts for availability, lifecycle exposure and potential alternatives, then discuss the findings with your purchasing and engineering teams.
Bring AI onto the device, with hardware that fits.
Tell us what your device needs to do. YM can help explore hardware, memory and power options, and coordinate technical discussions with our Edge AI project partner. Scope, development responsibilities and next steps are agreed for each project.
Packaging requirements, turned into practical execution.
Share your die, target package, expected volume and test requirements. YM will review the request and coordinate with packaging partners to assess process fit, capacity, samples and quotation.
Feasibility for each request depends on the chip, process and available capacity.
Requirement review
Die, target package, volume and test needs.
Feasibility & quotation
Process fit and capacity assessed with packaging partners.
Sample plan
If feasible, we align sample requirements and validation responsibilities with the production partner.
Production planning
Volume, schedule, testing and quality documentation are confirmed in the agreed quotation and production plan.
Tell us what you need.
Choose a request type and the form shows the fields that matter. We reply by email, or by WhatsApp / WeChat if you prefer.
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