Information to provide
The same information as for PDFN 5×6:
For an initial review: device type, die size and thickness, pad or electrode layout, target electrical and thermal performance, expected sample and annual volumes, and target application.
Before engineering quotation or pilot production: die drawing and pad map, wafer or die supply format and quality data, test specification and acceptance criteria, and confidentiality and IP terms.
How feasibility is evaluated
YM coordinates evaluation with manufacturing and test partners selected for the project. If the project is found feasible, the process route, responsible parties, and quoted items for that stage are set out in the proposal.
TOLL or PDFN 5×6: what to compare
There is no general rule for choosing between the two. The comparison should use the specific package drawings, your device parameters, and your thermal conditions.
| Compare | Based on |
|---|---|
| Current capability and conduction losses | Device parameters and each package's specified ratings and resistance |
| Thermal performance | Package thermal data, your board design, and cooling conditions |
| Board area and layout | The footprints in each package drawing |
| Die fit | Your die size and pad layout against each package's internal dimensions |
| Parasitics and switching behavior | Package data and your circuit topology |
| Assembly and inspection | Your assembly line's process and inspection requirements |
| Footprint compatibility | Existing footprints and any second-source requirements |
| Cost and capacity | The project quotation |
Final package selection depends on your own electrical, thermal, and reliability validation.
Before you commit
Agreed before you commit
Quoted items, quantities, prices, schedule, and payment terms are set out in the quotation and order terms agreed by both parties.
Depends on the project
Samples, test and reliability work, and quality documentation depend on the project and the partners involved. If any of these is a condition of your order, tell us before you commit: we confirm whether it can be provided, and tell you clearly if it cannot.
Submit a TOLL request
Send your device and package requirements through the inquiry form on our homepage and choose “Packaging”.
FAQ
Should we choose TOLL or PDFN 5×6?
It depends on a comparison of the specific package drawings, your device parameters, and thermal conditions; see the table above.
Can an existing PDFN 5×6 design move to TOLL?
It requires a new evaluation of die fit, board layout, and validation.
Is TOLL packaging available now?
TOLL projects are subject to partner capability and feasibility review for each request.