How projects are organized
Packaging, testing, and production are carried out by the partners responsible for each stage. How a project is organized, and which party quotes and contracts for which work, depends on the project and its stage, and is set out in the project proposal.
Packages you can submit
PDFN 5×6
Evaluated with partners per project.
TOLL
Subject to partner capability and feasibility review.
Other formats. TOLT, LFPAK, other power QFN/DFN, and other discrete package formats may be considered upon review, per project.
We give priority to power MOSFETs and other discrete device packaging requests.
From request to production planning
- Requirement review — device, die, target package, volume, test and reliability needs.
- Feasibility — partners assess process fit and capacity.
- Sample plan — where samples are planned, sample requirements and validation responsibilities are agreed with the partners involved.
- Production planning — volume, schedule, and price are set out in the agreed quotation and order terms.
Before you commit
Agreed before you commit
Quoted items, quantities, prices, schedule, and payment terms for each project stage are set out in the quotation and order terms agreed by both parties. There is no single sample or production MOQ; depending on the stage and the responsible party, quoted items may include NRE, engineering samples, pilot lots, and production MOQ.
Depends on the project
Samples, test and reliability work, and quality documentation depend on the project and the partners involved. If any of these is a condition of your order, tell us before you commit: we confirm whether it can be provided, and tell you clearly if it cannot.
What to prepare
For an initial review
- Device type and target package
- Die size and thickness
- Pad or electrode layout
- Target electrical and thermal performance
- Expected sample and annual volumes
- Target application
Before engineering quotation or pilot production
- Die drawing and pad map
- Wafer or die supply format and quality data
- Test specification and acceptance criteria
- Applicable confidentiality and IP terms
Packaging Line Development
For customers planning their own discrete packaging capability, early-stage topics can be discussed with partners on a project basis:
- Requirement definition
- Package and process route
- Equipment and partner coordination
- Pilot production planning
Packaging Line Development is currently limited to these planning discussions. It does not include equipment purchasing, factory construction, yield guarantees, or certification.
Submit a packaging request
Send your device and package requirements through the inquiry form on our homepage and choose “Packaging”.
FAQ
Who carries out the packaging?
Packaging, testing, and production are carried out by partners selected for each project. The responsible parties are set out in the project proposal.
Can you package our own wafers or dies?
This is reviewed per project; your wafer or die supply format and quality data are part of the evaluation.
Is there a minimum volume?
There is no single MOQ. Quoted items and quantities depend on the project stage and are set out in the agreed quotation.
Can reliability qualification be arranged?
Test and reliability work depends on the project and partners. If it is a condition of your order, tell us before you commit and we confirm whether it can be provided.